HMC-C007

HMC-C007

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Pieza del fabricante HMC-C007
Fabricante Linear Technology (Analog Devices, Inc.)
Descripción INGAP HBT DIVIDE-BY-8 MODULE 0.5
Categoría rf/si y rfid
Familia rf misc ics y módulos
Ciclo vital: New from this manufacturer.
Entrega: DHL FedEx Ups TNT EMS
Pago T/T Paypal Visa MoneyGram Western Union
Ficha de datos HMC-C007 PDF

Disponibilidad

En stock 1.043.420
Precio unitario $ 2026.08000

HMC-C007 Current price of is for reference only, if you want to get best price, please submit a inquiry or direct email to our sales team [email protected]

HMC-C007 Especificaciones

Tipo Descripción
serie:-
paquete:Bulk
estado de la pieza:Last Time Buy
función:Divide-by-8
frecuencia:500MHz ~ 18GHz
tipo de radiofrecuencia:VSAT
atributos secundarios:-
Tipo de montaje:Connector Mount
paquete / caja:Module, SMA Connectors
paquete de dispositivos del proveedor:Module

Shopping Guide

Shipping Rate
Shipping Rate

We ship orders once a day around 5 p.m., except Sundays. Once shipped, the estimated delivery time depends on the courier company you choose, usually 5-7 working days.

Shipping Methods
Shipping Methods

We provide DHL, FedEx, UPS, EMS, SF Express, and Registered Air Mail international shipping.


Payment
Payment

TT in advance (bank transfer), Western Union,PayPal. Customer is responsible for shipping fee, bank charges, duties and taxes.

Productos Destacados

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